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Profile
| Academic position | Associate Professor, Senior Lecturer, Reader |
|---|---|
| Research fields | Materials Engineering,Electrical Semiconductors, Components, Circuits, Systems,Theoretical Condensed Matter Physics |
| Keywords | Semiconductor materials and devices, Process simulations, Ab-initio and multiscale modeling, Nanostructured interfaces, Simulation-assisted nanoscale characterization |
Current contact address
| Country | United States of America |
|---|---|
| City | Columbus |
| Institution | Ohio State University |
| Institute | Department of Materials Science and Engineering |
Host during sponsorship
| Prof. Dr. Heiner Ryssel | Bereich Bauelementetechnologie, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB), Erlangen |
|---|---|
| Start of initial sponsorship | 01/05/2006 |
Programme(s)
| 2006 | Fraunhofer-Bessel Research Award Programme |
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Nominator's project description
| Future semiconductor devices will be so small that their structure needs to be known and controlled atom by atom. Professor Windl is one of the pioneers in the implementation and application of atomic-level simulation methods to semiconductor research, materials science, and in the semiconductor industry. The goal of his cooperation with the Fraunhofer Institute of Integrated Systems and Device Technology is to apply such techniques to the computational design of future generations of semiconductor devices. |